Current Research: Hot embossing techniques for BioMEMS research & design
The current standard in microfluidic prototyping is polydimethylsiloxane (PDMS) devices molded from SU-8 structures produced by photolithography. However, PDMS lacks the robust characteristics needed for many real-world applications, resulting in a necessary material change during the translational phase of research. We are interested in utilizing practical materials at all stages of microfluidic device design by taking advantage of hot embossing of thermoplastic materials.
Electrode integration is a critical element in point-of-care diagnostic devices, but existing processes are complex, expensive, or low throughput. We have developed a technique combining electrodeposition of electrodes with lithographic-scale resolution with hot embossed thermoplastic microfluidic system. This rapid, cost-effective approach allows for integration of 2D and 3D self-anchoring conformal electrodes.
Our solvent-vapor assisted thermal bonding process completes the fabrication cycle for polycarbonate devices with embedded structures.